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MEMS Packaging with 3D-MID Technology
Keywords: LED Packaging, Sensor Packaging, 3D Antennas
3D-MID* (moulded interconnect devices) technology (which is already broadly used for 3D-MID mobile phone antennas) is also used for MEMS packaging and sensors applications. 3D-MID allows miniaturization by the integration of mechanical and electronic functions in one part. The 3D electronic circuit is integrated into a 3D plastic casing or carrier, making it possible to achieve much more compact construction and much greater function density. More and more applications involving electrical and electro-optical circuits are made using 3D-MID technology. Typical 3D-MID applications are: -Sensor packaging -LED packaging -RFIDs -Antennas. The main areas of application are in the automotive, medical, industrial technology and telecommunications sectors.
Nouhad Bachnak, Director 3D-MID Technology
Cicor
Boudry, NE 2017,
Switzerland


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