Here is the abstract you requested from the Medical_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|New SMD Packaging Technology for Thin-Film Passive Components in Medical Implantable Devices|
|Keywords: Thin-Film, High Ohmic Resistor, 0201 SMD|
|The requirement for smaller size, improved reliability, and reduced cost is driving innovation in the passive component realm and especially the medical industry. The desire for smaller form factor resulted in the development of a new packaging platform for AVX's already high reliability thin film passive components. AVX's CrSi resistor technology featuring 1000 Ohm/square sheet resistance, high voltage stability, and controllable TCR as low as +/- 50 ppm has been the technology platform for a large array of wire-bond or BGA terminated resistor networks. These devices have a 6 yr history in implantable devices without incident. A new SMT 0201 and 0402 size discrete thin film resistor structure with Flexiterm ® plated terminations is being introduced and featured in this presentation. The new structure is characterized by even greater stability than traditional thin film resistors, high voltage break-down (up to 1000V) and the capability to ‘burn-in' the parts if requested. AVX has produced 0201 resistors up to 10 MOhm with 1% tolerance and high stability as shown on the life test and voltage breakdown charts. In addition to resistors, our thin-film technology and SMT Flexiterm® packaging technology allows for making high quality capacitors, inductors and combinations of those passive elements into filters, matching-networks, and other small, low and high frequency devices.|
|George Korony, Member Technical Staff
Myrtle Beach, SC