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Processing Challenges from Mixed (Surface Mount & Wire Bonding) Product Assembly
Keywords: Wire bonding, Advanced Packaging, Mixed Processing
As the requirements for size reduction in microelectronics packaging become more aggressive, sometimes it becomes necessary to mix wire bonding and surface mount technology to achieve the desired form factor. In addition to the mixed interconnect technology, these highly miniaturized assemblies may have components on both sides of the circuit board. This unique assembly process as well as the tightly constrained designs result in numerous manufacturing challenges that need to be addressed. Topics to be addressed: Post-SMD water wash cleanliness for wire bonding, wire bonding, tight spacing between wire bonds and surface mount devices, MSL issues, and other process related challenges.
Luke Horak, Mechanical Engineer
Rockwell Collins
Cedar Rapids, IA

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  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic