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Stacking of Known Good Rebuilt Wafers without TSV and without interposer for Medical Applications
Keywords: wafers, 3-d interconnection, stacking
The 3-D interconnection started at 3D PLUS in 1996 and led to the stacking of nearly all types of analogical and logical components, sensors, MEMS, etc for the Hi-Rel field (Space, Defence, Medical, Industrial). This technology is extremely robust (-130°C +175°C, 40000g), and is fully qualified by all worldwide most important Space Agencies, for Defence applications and Harsh environment. A technological break started in 2002 ; it consisted in another 20 to 30 reduction factor of the weight and volume of these 3-D modules. The Z pitch is 100µm and the X Y size is given by the size of the larger die plus 100µm of polymer around it. This is a stacked of Known Good Rebuilt Wafer of full wafer level technique. The dice are received in wafers and following operations are carried out : - Pick, flip and place of the good dice on a ‘sticking skin' - Moulding of the whole of this ‘pseudo wafer' in order to obtain what we call a Known Good Rebuilt Wafer (KGRW). These two first steps are already developed by Freescale (RCP technique up to 300mm), then Infineon and now about ten companies are developing this 2-D approach. The stacking steps are: - Stacking and gluing of KGRW 1, 2, 3…, n, by means of an adhesive film. For some applications, the known good burn-in wafers can be made before stacking. - Dicing of these stacked rebuilt wafers by techniques identical to the dicing of standard wafers - Metallization of the dicing streets with nickel + gold by electroless chemical plating identical to the UBM plating technique - Direct laser patterning by laser with our edge connection technique up to 100µm pitch. Below this pitch, the Thru Polymer Via (TPV) are made through the stacked wafers. The equivalent pitch will be 20µm. it can be noticed that the shielding can be made on the dicing street. - Electrical test at the stacked wafer level - Singulation This approach allows to use standard dice without any modification. It is multi sources and the stacking of the good rebuilt wafers allows to obtain an excellent yield. A development agreement has been signed with a semiconductors manufacturer. Medical applications will be presented: - Micro modulator with 5 ASICs within a 3 mm diameter tube, - Prototypes for the major US pacemaker manufacturer and one European pacemaker manufacturer A quasi pacemaker module of 0,5 cm3 (16 times smaller than the standard pacemaker: 8 cm3) will be shown - Micro camera for Hard X-Ray for Philips Medical (DE). - Smart Pill is developing with the French Hospital organization. Industrial applications: - Abandoned sensors for Airbus and industrial areas. This full wafer level approach will allow to build System in Package (SiP) or ‘Abandoned Sensors' at very low costs, since the process uses mainly the steps of wafers building; the ‘panelization' allows to be in parallel processing from A to Z steps. Moreover, the use of Known Good Rebuilt Wafer like the RCP allows to stack Good wafer at the reverse what is impossible with the wafer to wafer approach.
Christian Val, CEO
3D Plus
Buc 78532,
France


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