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Wafer Level Technique Applied to the Micro-Camera
Keywords: Wafer Level Packaging, Micro-camera, 3-d
The 3-D technology started on 1989 with Thomson-CSF and then continued at 3D Plus in 1996, leading to the stacking of nearly all types of analogical and digital components, sensors, MEMS, etc…. This technology is extremely robust (-130°C to +175°C, 40 000g) and is fully qualified by all worldwide most important Space Agencies, for defense and harsh environment. A technological breakthrough started in 2002, it consisted in another 20 to 30 reduction factor of the weight and volume of these 3-D modules. This technology is based on the stacking of Known Good Rebuilt Wafer (KGRW).The name given to this technology is Wirefree Die on Die (WDoD). The color CCD Micro-Camera Head are manufactured from 2001. Firstly, with the CCD 1/6, then 1/10 and now thanks to the WDoD the Micro-Camera Head 1/15 is developed. The main characteristics are: - Extremely miniaturized: 1.8 x 1.8 x 9 mm - Light weight: 0.05 g - High resolution (YE, Cy, Mg and G complementary colour mosaic filters) - High sensitivity - Low dark current - Excellent anti blooming characteristics - Continuous variable speed shutter A DSP controlled electronic board can be connected to the micro-camera. This product is available for PAL video systems. A description of the 3-D technology used for the manufacturing of these products will be presented.
Christian Val, CEO
3D Plus
Buc 78532,
France


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