Here is the abstract you requested from the MIL_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Performance and Reliabilty Microelectronics Packaging|
|Keywords: high-reliability, packaging, modeling|
|There are many challenges associated with achieving higher microelectronic device performance and functionality in a smaller form-factor package for long-term, high-reliability applications such as military and space. With a proven record of performance and reliability, as well as established design, manufacturing, and testing methodologies, hermetic ceramic packaging with peripheral interconnects has traditionally been used for high-reliability applications. Driven by the need to improve performance and functionality while reducing size and cost, commercial products have migrated to plastic packaging and higher I/O area array interconnects. In contrast to military and space applications, high volume commercial products such as cell phones are essentially throw-away electronics that are not specifically designed for high-reliability applications. As such, design, manufacturing, and testing methodologies need to be developed and demonstrated for high-reliability advanced packaging. This presentation will provide an overview of the advantages and disadvantages of different packaging technologies for high performance and reliability applications. Additionally, modeling and characterization tools that can be used to develop and implement new designs and materials into the high reliability market will be discussed. Examples of high temperature cofired ceramic (HTCC), low-temperature cofired ceramic (LTCC), and plastic packaging will be presented.|
|Kevin G. Ewsuk, Manager, Advanced Prototyping Science and Technology
Sandia National Laboratories