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Impact of Dwell Time on Solder Joint Reliability under Four Point Bend Testing
Keywords: Bend Testing, Dwell Time, Solder Reliability
Portable electronic assemblies are subjected to a wide range of mechanical loading conditions such as twist, drop, bend and vibration during usage. Studies have been carried out in literature to evaluate the mechanical fatigue durability of electronic assemblies under bend, shock and vibration loading. Failure of the solder interconnect is the primary mode of failure under such loading conditions. However the impact of dwell time on the failure of solder interconnects during mechanical loading has not been investigated in detail. This study focuses on understanding the impact of dwell time on the mechanical fatigue durability of solder interconnects under four point bend testing. 2512 resistor packages were soldered onto the test boards using four different solder compositions (SnPb, SAC105, SAC305 and SN100C). In order to evaluate the impact of dwell time, the boards were tested with a 60 second and a 300 second dwell time on both extremes of the loading profile. It was observed that a change in dwell time of the loading profile resulted in a change in the characteristic life of the solder interconnects.
Sandeep Menon, Graduate Research Assistant
Univeristy of Maryland - CALCE
Silver Spring, MD

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