Micross

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Here is the abstract you requested from the MMC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Rated Power Improvement for Low Ohm Current Sense Resistor by Optimum Thermal Management and Innovative Packaging Technique
Keywords: Power efficiency improvement, Thermal Management, Innovative packaging for optimum heat dispersion
See presenter on-site for more information. Akhlaq Rahman, Fred Olinger Thin Film Technology Corporation P: 507-382-8445 ex 56 E: arahman@thin-film.com
Akhlaq Rahman, Development Engineer
Thin Film Technology Corporation
North Mankato, MN
USA


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