Here is the abstract you requested from the MMC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Crack Development of Aluminum Thin Film Deposited on Flexible Substrate under Low Cyclic Bending Fatigue Condition|
|Keywords: Bending fatigue, Aluminum thin film, Cracks developement|
|Aluminum thin films on flexible substrates are very popular as a back electrode in solar photovoltaic technology. However, during their manufacture and use, the structure of thin film and substrate is subjected to cyclic bending which leads to cracks and ultimately electrical conductivity failure. This work was designed to investigate the initiation and propagation of cracks at low bending cycles and the consequent increase in the electrical resistance. The effect of film thickness, bending diameter, and number of cycles on both crack development and electrical resistance was investigated. Scanning electron microscopy images was obtained to evaluate the crack development under different conditions. It was found that cracks development greatly depends on the number of cycles, especially at low number of cycles. The possibility of cracking increased with the thickness of the film and decreased with the diameter of the bending diameter.|
|Mohammad M. Hamasha, Doctoral Student/Research Assistant
State University of New York at Binghamton
Johnson City , NY