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Metallic TIMs for High Brightness LED Packaging
Keywords: LEDs, Thermal Reliability, Bond Material Properties
It is known that successful packaging of high-brightness, high-power LEDs requires the use of bonding materials with unique property attributes. These include high thermal conductivity, low cure temperatures, and reliability through extended life thermal cycling. Various methods/materials exist which possess these attributes. Among these, and unsurpassed in terms of thermo-mechanical reliability, are numerous metallic TIMs and solders. A discussion of these materials will include packaging techniques required for use and the expected performance derived from independent thermal materials testing, as well as in-situ testing completed on functional LED boards.
Amanda Hartnett, Applications Engineer
Indium Corporation
Clinton, NY

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  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
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  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
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  • Specialty Coating Systems
  • Technic