Here is the abstract you requested from the MMC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Metallic TIMs for High Brightness LED Packaging|
|Keywords: LEDs, Thermal Reliability, Bond Material Properties|
|It is known that successful packaging of high-brightness, high-power LEDs requires the use of bonding materials with unique property attributes. These include high thermal conductivity, low cure temperatures, and reliability through extended life thermal cycling. Various methods/materials exist which possess these attributes. Among these, and unsurpassed in terms of thermo-mechanical reliability, are numerous metallic TIMs and solders. A discussion of these materials will include packaging techniques required for use and the expected performance derived from independent thermal materials testing, as well as in-situ testing completed on functional LED boards.|
|Amanda Hartnett, Applications Engineer