Micross

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Etching Method for Enhanced Contrast of Cu-Al Intermetallic Compounds on Aluminum Bond Pads
Keywords: intermetallic coverage, copper wire bonding, reliability
Copper (Cu) wire bonding has begun to replace gold wire bonding thanks to its obvious advantages including cost reduction, higher electrical conductivity, higher thermal conductivity, and slower growth of intermetallic compounds with aluminum (Al). One of the drawbacks of the slower intermetallic growth is that intermetallic coverage has traditionally been difficult to measure. As in Au ball bonding, intermetallic coverage in Cu-Al bonds is a key bond quality measure. This paper will present a method to etch the Cu ball off the Al bond pad and then enhance the color contrast of the Cu-Al intermetallic coverage relative to the unbounded Al. This method can be used for both Cu and Pd-coated Cu wire bonding to Al pads.
Son Nguyen, Student
Kulicke and Soffa Industries, Inc.
Fort Washington, PA
USA


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