Here is the abstract you requested from the MMC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advance Anisotropic Conductive Paste (ACP) for Flip Chip Assembly|
|Keywords: flip-chip , conductive , pre-applied|
|Ken Araujo, Area Manager
NAMICS Technologies, Inc.