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Here is the abstract you requested from the OPTO_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Laser Seam Sealing of Optoelectronic Packages
Keywords: Laser Welding, Seam Sealing, Design for manufacturing
The use of laser welding as a joining process for seam sealing of optoelectronic and electronic packages offers some unique advantages over existing resistance or epoxy based techniques. To implement or migrate to laser welding as a highly reliable seam sealing process certain key selections and design features are needed that encompass the laser, materials, platings, part geometry and part tolerances. An overview of the key features of laser welding and details of package design rules is provided.
Geoff Shannon,
Miyachi Unitek Corporation
Monrovia, CA
USA


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