Micross

Abstract Preview

Here is the abstract you requested from the SysPack_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Thermal Requirements of QSFP modules
Keywords: QSFP, Thermal , Heat Sinks
Thermal Analysis of 5-Watt QSFP Modules. Eight high-power QSFP modules were modeled using Flotherm to determine the thermal requirements to keep the module case temperature below 70C with 40C air at 3 Km elevation. A detailed model for the QSFP, cage and air channel were used to determine the heat sink solution and airflow required to cool two – 1X4 QSFP cages, with each QSFP dissipating 5 Watts. Different heat sinks, baffles and airflow conditions were evaluated. Factors like contact resistance between the case and the heat sink, heat sink base heat spreading and effect of airflow bypass were investigated.
Adriana Romero, Senior Consulting Engineer
Electronic Cooling Solutions
Santa Clara, CA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems