Here is the abstract you requested from the SysPack_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Silicon Interposers present assembly challenges|
|Keywords: 3D/2.5D, Silicon Interposer, Advanced assembly|
|Silicon interposers are rapidly being added into large IC packages as a means to reduce costs and pressure to move to new lower litho nodes. Effectively using interposers means adopting new chip interconnection methods including copper pillars, thermosonic bonding, and dissimilar underfill epoxies. This presentation will discuss how silicon interposers are evolving into different segments, such as silicon bridges vs. simple interposers. It will discuss the assembly challenges with each. And it will dicsuss the trade-offs of Known Good Die vs. the “Good Enough Die” concepts.|
|Phil Marcoux, Consultant