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SFP+ Thermal Enhancements Study
Keywords: SFP+, Interconnects, Thermal
This presentation will describe an investigation into thermal design improvements of a stacked SFP+ front panel interconnect system. The power dissipation of front panel interconnect modules continues to increase, posing unique cooling challenges because of the limited space available for cooling and inherently poor airflow at this section of an electronics card. The challenge is compounded by virutue of the stacked module configuration, the EMI shielding features that limit internal air flows, and the manner in which the heat is generated in a module and dissipated into the module PCB. Numerical analyses are presented that consider the impact of adding fins or extended surfaces, improved main PCB conductivity, module thermal design, and creating open cooling channels through the front panel. The findings show that the most significant impact is made by forcing air through front panel cooling channels with a pressure differential between external atmosphere and the line card. A custom wind tunnel test rig is developed to establish correlation with the simulation. The design and instrumentation of the test rig and interconnect structures are described along with the test results.
Paul Hattan, Mechanical Engineer
Devicix, LLC
Eden Prairie, MN
USA


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