Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Direct Aluminum Soldering Paste|
|Keywords: Aluminum, Soldering, Solderpaste|
|Soldering aluminum to copper provides an excellent thermal and electrical connection pathway for this increasingly popular joining requirement. Typically, aluminum soldering is accomplished by plating over the aluminum to make that surface solderable. The development of a direct aluminum soldering paste eliminates the costly plating operation needed to make certain aluminum alloys solderable. The stable direct aluminum soldering paste provides for a soldering option that will work via induction, oven reflow, hot plate, or soldering iron techniques. The paste consists of a special flux medium and lead-free solder alloy. Evaluation of the solderpaste was by several methods. Solderability testing compared the paste on a variety of aluminum alloys. Soldering joint cross-sectioning followed by scanning electron analysis proves the viability of the solder joints. Tensile strength testing of the solder joints measured the strength of the copper to aluminum and aluminum to aluminum solder joints.|
|William Avery, Metal Joining Specialist
Superior Flux and Mfg. Co.