Abstract Preview

Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Collider Jets Cooling Method of Microprossesors
Keywords: New Cooling Method, Interlocked Collider Jets, Heat sinks, cold plates
The new system of cooling of processors is offered on the basis of use of the liquid jets directed towards each other which for sharp artificial turbulization streams have relative micro shift on the central axes snuffled. Dissipating heat and apparatus therefore from a processor heat dissipation surface is described. In an embodiment, first jets are streamed along the heat dissipation surface in a first direction and are spaced apart from one another. Second jets are streamed along the heat dissipation surface in a second direction at least substantially opposite the first direction and spaced apart from one another. Coolant used to provide the first jets and the second jets is exited away from the heat dissipation surface. The first jets and the second jets are offset from one another in a transverse direction with respect to the first direction and the second direction, and the first jets and the second jets pass side-by-side with respect to one another. Creation of such counter streams generated by combinations round and rectangular nozzles will allow to make break in development single-phase liquid systems and to reach parameters of thermal resistance at a level 3.5 - 4 degrees on 100 W/sm2, that at least in 2-2.5 times it is better than any available laboratory samples and in 4-5 times it is better industrial, suggested by leaders of the market. We would like to present our experimental data of heat sinks and cold plates made using the design based on the Collider Jets Cooling Technology Method.
Mikhail Spokoyny, Research Director, Prof, EEPTL, Plasma Inst, DMEM
A.J. Drexel University
Philadelphia, PA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic