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Identifying Thermal Bottlenecks and Shortcut Opportunities in Electronics Cooling Applications
Keywords: Computational Fluid Dynamics, Thermal Design, Electronics Cooling
Electronics thermal management involves the design of an electronics system to facilitate the effective removal of heat from the active surface of an integrated circuit (the heat source) out to a colder ambient surrounding. As the heat travels from the source to the ambient it passes through various thermal bottlenecks. It also encounters areas where there are opportunities to insert new ‘shortcut' heat flow paths. Identifying the locations and relative magnitudes of such thermal bottlenecks and shortcut opportunities as part of simulation post-processing will allow fewer and more effective thermal design modifications to be identified and implemented. This presentation will introduce the concepts involved and demonstrate a worked example.
Travis Mikjaniec,
Mentor Graphics Corporation
Fremont, CA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems