Abstract Preview

Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Applications of Thermal Interface Materials in Test of IC Packages
Keywords: thermal interface materials, test of IC packages, cost
Thermal Interface Materials (TIMs) have a wide range of applications in the semiconductor industry as they provide a conductive interface between two surfaces of dissimilar materials. A typical application is TIM1 where a TIM is placed between the exposed silicon surface of the package and the integrated heat spreader (IHS). In the testing of packages in high volume manufacturing (HVM), thermal tools are used to control the temperature of the package to meet quality control criteria. A TIM is used between the thermal tool and the package dynamically, namely, the same tool is re-used to test the next package. This poses additional challenges to the performance of the TIM which make the selection of suitable materials more complex than a typical TIM1 application. This work highlights some of the challenges faced in the semiconductor industry and the requirements of TIMs used in test to meet targets of cost and reliability.
Jaime A. Sanchez, Ph.D., Test R&D Engineer
Intel Corporation
Chandler, AZ

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems