Abstract Preview

Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Characterization of Thermo-Electric Coolers and Applications to Test of IC Packages
Keywords: thermo-electric coolers, fundamental properties, characterization techniques
Thermo-electric coolers (TECs) are used in thermal solutions developed for high volume manufacturing (HVM). Their performance and reliability are critical parameters that affect the quality of the test and have been studied extensively. This presentation reviews some of the fundamental characterization done to understand the performance of TECs, improve their operation and to develop numerical models of TEC-based thermal solutions. Using simple metrologies that capture the temperature at various locations, and voltage and current inputs to the TEC, the properties of different TEC modules have been characterized and their behavior modeled with high accuracy using Finite Element Analysis (FEA) tools.
Jaime A. Sanchez, Ph.D., Test R&D Engineer
Intel Corporation
Chandler, AZ

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems