Micross

Abstract Preview

Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Thermal Pyrolytic Graphite Composite with Coefficient of Thermal Expansion Matching for Advanced Thermal Management
Keywords: CTE, heat spreader, thermal management
Thermal management is an increasingly critical problem in a variety of electronics industries, including defense, aerospace, telecommunications, and lighting. As power requirements increase and size requirements decrease, innovative materials with high thermal conductivity (TC) and coefficient of thermal expansion (CTE) matching are desired to solve these thermal challenges. In this presentation, Momentive Performance Materials introduces to the broad electronics industry a novel high-TC and CTE-matched composite based on the unique properties of thermal pyrolytic graphite (TPG). TPG with its highly-oriented graphene structure exhibits excellent in-plane thermal conductivity (>1500 W/m-K), and very low density (2.25 g/cm3). TPG composite with Al or Cu encapsulation, traditionally known as TC1050®, is a great thermal management material, but lacks CTE matching. As demonstrated in this study, bonding TPG with CTE-matched alloys, such as WCu, MoCu, and AlSiC, simultaneously achieves high TC (>800 W/m-K) from the TPG core and low CTE (<9x10^-6 /C) from the metal encapsulation. Compared with the traditional two-component architecture, heat spreaders made of this CTE-matched TPG composite not only increase the efficiency of thermal spreading, but also eliminate one of thermal interfaces and reduce the integration cost. The measurement of TC and CTE as a function of TPG volume loadings on the TPG-MoCu composites, shown as examples, matches the theoretical calculation and confirms the high-TC and low-CTE claims. Performance of TPG composite as a heat spreader material in several thermal management applications will also be presented in the paper.
Wei Fan, Development Scientist
Momentive Performance Materials
Strongsville, OH
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems