Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Liquid Adhesive Selection and Performance in Electronics Applications|
|Keywords: Thermal Interface Materials, Adhesives, Applications|
|Most electronics applications requiring thermal management contain assemblies that are composed of a thermal interface material that is placed between a heat source and heat sink. Typically, a mounting device is used to maintain good contact between the the source and sink. Thermally conductive adhesives have become more widely used in modern applications since they eliminate the need for fastening devices and the application of high mounting forces to ensure good thermal contact. Additionally, adhesive systems have the advantage of automated placement and assembly. It is the goal of this presentation to discuss the thermal and mechanical performance of adhesive materials in electronics applications. In most cases, a balance between thermal conductivity, bond line thickness, mechanical properties, and reliability concerns must be obtained to optimize the performance of an adhesive material. This balance is not always obvious and the factors that influence a materials selection decision will be explored.|
|John Timmerman, Senior R&D Engineer