Abstract Preview

Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Piezoelectric Active Cooling Substrates for Thermal Management of Microelectronics
Keywords: Active cooling, Thermal Management, Synthetic Jet
Thermal management is challenging in high-density microelectronics packaging because of the need for affordability and high-power densities. Particularly, RF communication and radar systems require high-power levels for operation and reliability, and small footprints to control intrinsic losses and meet design constraints. These challenges become more difficult with affordability requirements due to inadequate cooling, implementation costs, or material costs. Air-cooling is simple; yet, existing commercial approaches lack necessary thermal management because of fan efficiency, reliability, and low thermal effectiveness . Liquid- and phase-change-cooling improve thermal effectiveness but reduce reliability and increase implementation costs. Material approaches - thermal ground planes or semiconductors– are challenging because these materials rarely align with mature commercial solutions. Even when affordable, localized cooling improves thermal ground planes effectiveness. An interesting compromise uses discrete local fluid handling and air cooling. In this approach, fluid cavities and actuators are integrated into PCB. Magnetic coil actuators integrated into a PCB demonstrated 3.6W/cm2 (typical fan is 1W/cm2). However, the magnetic field is detrimental to RF applications. Alternatively, piezoelectric actuators have proven 40% more effective than fan cooling1 in non-embedded applications. The challenge to adapting from magnetic to piezoelectric actuators is to achieve high flowrates because piezo-actuators have lower displacement and higher frequencies. This investigation explores frequency and displacement effects on cooling rates for piezo-actuators embedded in PCB. This effort includes demonstration of affordable fabrication for the embedded microfluidics and actuators. Further concept development includes integration with thermal ground planes. 1- R. Mahalingam, N. Rumigny, and A. Glezer. Thermal Management Using Synthetic Jet Actuators. IEEE Transactions on Components and Packaging Technologies. Vol 27. No. 3. Sept. 2004. pp. 439-444. 2- Y. Wang. G. Yuan, Y-K Yoon, M.G. Allen, and S.A. Bidstrup. Active Cooling Substrates for Thermal Management of Microelectronics. IEEE Transactions on Components and Packaging Technologies. Vol 28. No 3. Sept. 2005. Pp. 477.483.
Brian A. English, Principal Investigator
EngeniusMicro LLC
Atlanta, GA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic