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Performance of Liquid-Based Microchannel Cooling with Application to Electronics on Aircraft
Keywords: Aviation, Electronics, Microchannel
Thermal management of waste heat generated by Electronics / Electrical (E/E) modules on commercial airplanes was investigated. In particular, the investigation focuses on the practicality of using liquid-based microchannel conduction cooling of printed circuit boards with built-in thermal planes and thermally conductive covers. In lieu of their application on aircraft, fluid flow rate acts as the most influential parameter when estimating system lifetime cost due to the added weight of the fluid. Because of this these system call for a unique design approach from traditional microchannel systems where efficiency is measured in terms of fluid mass flow per heat dissipated. A simulation model has been developed to estimate the thermal performance of the microchannel. From this an optimization study was performed to give an optimized cold plate design. A test setup was constructed to test the optimized microchannel; four fluids have been used in the study as well as a wide range of inlet temperatures and heat dissipations. In conclusion the experimental results agreed well with model predictions. From these results the model was exercised to make further estimates on system capital and lifetime costs from pump power and system weight to make final recommendations on system configuration.
Bryce Shaffer, Research Assistant
Purdue University
Denver, CO

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