Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Packaging - The Inward Migration|
|Keywords: DARPA, Nanotechnology, Thermal management|
|Throughout the Information Age, starting with the ENIAC in 1946, thermal management technology has played a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. During these 65 years, thermal packaging has migrated from ventilation and air-conditioning to cabinet cooling, to package cooling with heat sinks and cold plates and is today addressing on-chip hot spots. For the past decade, and particularly, the past 4 years, DARPA has aggressively pursued the application of micro- and nano-technology to reduce or remove thermal constraints on the performance of defense electronic systems. Following a brief introduction, attention will turn to a detailed discussion of the DARPA Thermal Management Technologies portfolio with emphasis on the goals and status of these effort relative to the current State-of-the-Art. The limitations inherent in today's thermal management methodology will provide a springboard for discussing the need for a new thermal packaging paradigm, Embedded Thermal Management.|