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Thermal Packaging - The Inward Migration
Keywords: DARPA, Nanotechnology, Thermal management
Throughout the Information Age, starting with the ENIAC in 1946, thermal management technology has played a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. During these 65 years, thermal packaging has migrated from ventilation and air-conditioning to cabinet cooling, to package cooling with heat sinks and cold plates and is today addressing on-chip hot spots. For the past decade, and particularly, the past 4 years, DARPA has aggressively pursued the application of micro- and nano-technology to reduce or remove thermal constraints on the performance of defense electronic systems. Following a brief introduction, attention will turn to a detailed discussion of the DARPA Thermal Management Technologies portfolio with emphasis on the goals and status of these effort relative to the current State-of-the-Art. The limitations inherent in today's thermal management methodology will provide a springboard for discussing the need for a new thermal packaging paradigm, Embedded Thermal Management.
Avram Bar-Cohen,
DARPA-MTO
Arlington, VA
USA


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