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Market Needs for Thermal Materials Developments for Semiconductor Packaging
Keywords: Thermal materials, Market needs, Semiconductor
IGBT, RF, LED, and communications semiconductor devices are packaged in a very broad range of discrete and multichip modules which use many different materials. Developments in available packaging materials will be explored further, along with continuing market needs that remain unmet, but which are the target of a multitude of development programs. Materials must meet varying and in some cases competing requirements including electrical conductivity or resistivity, thermal conductivity and expansion matching, surface properties and joining process requirements,temperature sensitivity, cost, manufacturability, and reliability. Significant progress has been made in material and process developments in the last three years that address some of these market needs. However, there have also been some remarkable failures in the electronics market, remarkable in some instances due to early promise that has not yet been realized with commercially practical materials. This is recognized as an indication of barriers that must be overcome during development of a technical strategy and a supporting business plan for certain of these types of materials. Drivers for development of newer materials include cost, higher reliability, higher operating temperatures, new market demands for reduction in size and weight, higher frequency operation, and radical increases in thermal performance of the complete module. Recent announcements by materials manufacturers and semiconductor manufacturers worldwide will be used to illustrate developing needs and proposed solutions for new materials. References for 2010-2011 development announcements will be included.
David L. Saums, Principal
DS&A LLC
Amesbury, MA
USA


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