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Moisture Control for Electronic Packaging
Keywords: Moisture control, Thermal impact, Package and material design
Moisture control and thermal management for electronics share many similarities: They are both governed by Fick's Law, they both require intelligent materials selection and manufacturing, and both may be ignored by the electrical design engineer and left to the mechanical or packaging engineer to solve. One difference is that the failure for poor thermal management design is relatively rapid (i.e., measured frequently in hours to failure); poor moisture control results in failures that occur, generally, in weeks and months after assembly and initial operation. Another difference, as evidenced by the ATW Thermal Management workshop programs, is that thermal management knowledge and awareness is twenty years ahead of knowledge of moisture management for electronics. Early semiconductor packaging addressed moisture management with hermetic packages, which often create additional thermal management issues. Moisture control strategies can therefore impact thermal management requirements and design solutions. As hermetic packaging became more of a specialized market niche, moisture management for electronics can become problematic if not addressed early in design. Moisture control in electronic packaging consists of: 1. Intelligent material selection and package design to minimize ingress of moisture due to leaks and diffusion; 2. Careful manufacturing to minimize the amount of moisture in the assembly; 3. Proper selection of adsorbents to control moisture for the required or expected service life. This presentation will cover the basic concepts of moisture control (also known as active packaging) and will include one specific automotive application for illustration.
Kenneth Credle, Business Development Leader Electronics
Multisorb Technologies
Buffalo, NY
USA


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