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INDIUM Heat-Spring® and Its Use In RF Flangeless Packages
Keywords: TIM, Indium, RF
Indium as a Thermal Interface Material has multiple advantages in high power RF devices. These benefits include decreased thermal resistance from junction to heat sink, ease and consistency of TIM application, resistance to pumping, and decreased mounting pressure/torque requirements. On flangeless RF packages these benefits enable cheaper, higher performing packages and increased value in end use RF industrial systems. Highlighted in this presentation will be the Microsemi T11 RF package and the .003
Ben Samples, Sr. RF Packaging Engineer
Bend, OR

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic