Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|INDIUM Heat-Spring® and Its Use In RF Flangeless Packages|
|Keywords: TIM, Indium, RF|
|Indium as a Thermal Interface Material has multiple advantages in high power RF devices. These benefits include decreased thermal resistance from junction to heat sink, ease and consistency of TIM application, resistance to pumping, and decreased mounting pressure/torque requirements. On flangeless RF packages these benefits enable cheaper, higher performing packages and increased value in end use RF industrial systems. Highlighted in this presentation will be the Microsemi T11 RF package and the .003|
|Ben Samples, Sr. RF Packaging Engineer