Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|An Open Power and Cooling Architecture|
|Keywords: liquid, open, standard|
|Air cooling is becoming increasingly unattractive for new designs ofservers, storage arrays and network switching and routing. Until recently, liquid cooling has been regarded as too complex, unreliable and expensive. Concurrently, the electronics industry has standardized cabinets and enclosures (e.g. 1U, ATCA etc.). This presentation outlines a cost effective, reliable power and cooling architecture. It may have the potential of being the basis for a standard. Consisting of a number of chassis in an industry standard rack, it incorporates, in a first version, 100KW of power and cooling for 160 4U blades plus associated switch fabrics. It is envisioned that the blades could house server motherboards, network line cards or even disk arrays. As all electronic components are field replaceable, the same mechanical infrastructure can be used for several generations of electronics. An illustrative example will cover its application to high performance computing and the benefits accrued.|
|Phil Hughes, CEO
Clustered Systems Company, Inc
Santa Clara, CA