Abstract Preview

Here is the abstract you requested from the Thermal_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Server Power Reduction Through On-Chip Liquid Cooling
Keywords: Liquid Cooling, Server, power reduction
For many years thermal management has continued to depend on air based heatsink-fan applications. Through the demand for "over-clocked" processors in the high performance desktop, sealed liquid cooling systems have become mainstream and now demonstrate the performance and reliability necessary to be viable options for the datacenter server. As reducing power consumption of datacenters becomes increasingly important, every aspect of the server becomes an opportunity to optimize power efficiency. In this session, the successful development of a 1U liquid cooling system is showcased with the design goal of reducing total power consumption of the server while accommodating additional design considerations for system life, dimensional constraints, manufacturability, cpu power headroom and Cost.
Geoff Lyon, CEO
Coolit Systems
Calgary, Alberta

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems