Here is the abstract you requested from the TT_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Aerosol Jet® 3D Interconnects as an Alternative to Wire Bonding for Complex, High I/O Applications|
|Keywords: 3D System Integration, Interposer, Printed Electronics|
|Increases in electronic circuit density pose interconnect challenges for the packaged chip's electrical, mechanical, and thermal integrity. This increased interface routing (interposer) and ever smaller package demands are pushing manufacturing limits beyond today's capabilities. These requirements are primarily driven by mobile handheld devices. The Aerosol Jet printed electronics process is being used to deposit a wide variety of materials onto various substrates (planar, non-planar, and 3D) without conventional masks or thin-film equipment. The process is non-contact, enabling traces to be printed over steps or curved surfaces. Highly conductive, fine pitch features to below 10 microns in width have been printed. A recent project successfully demonstrated Aerosol Jet's capabilities in advanced semiconductor packaging. The challenge was to replace an 8-layer PCB with a single layer board printing all of the 1024 I/Os. Aerosol Jet demonstrated a consistent die-to-substrate interface with a decreased contact pitch of 50 microns and a trace width of 25-30 microns. All traces originated on the chip bond pads and ended on PCB mounted connecters without the need for any crossovers. A silver nano-particle material was used to achieve low resistance with very high conductivity at curing temperatures below 220C. Challenges encountered include inconsistent ink wetting to the various surfaces and tool alignment issues caused by hand mounted die to PCB. This presentation will detail the use of Aerosol Jet technology for complex, high pin-count applications as an alternative to wire-bonding that can enable smaller contact pitch, narrower conductive traces, improve electrical path integrity, enhanced device reliability, and minimize the finished package size.|
|Urs Berger, Sr. Business Development Manager