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Low-Cost Adhesives for Temporary Substrate Support During Thinning and Backside Processing
Keywords: Adhesive, Thinning, Cleaning
Several materials and practices are commercially available to support thin substrate handling in 3-D packaging. They include both thermoplastics and thermosets, all with specific process and tooling requirements that define throughput and cost. This paper presents several existing practices in the industry and describes alternative low-cost adhesives and processes. Many of these options are available and are easily integrated, provided that a customer's process can be tuned to accept such materials. Low-cost temporary support materials allow grinding and polishing to <20um while also protecting front side devices from backside processing to include through silicon vias (TSVs) and the associated cleans and metallization steps. Low-cost adhesives can sustain shear forces of the grinding process, resist temperatures of via etch, low outgassing during CVD processing (e.g. oxide deposition), and resist various chemicals during cleaning. These efforts are aimed at simplifying the overall process, aligning chemistry, and many times, eliminating the need for complicated cleans. By tailoring a customer's process to accept a lower-cost adhesive, new ways of simple and rapid cleaning or even detergent washable systems may be integrated. Using these approaches, a safer working environment, or green factory, may be achieved while reducing the use of organic solvents and eliminating waste. Several options will be presented for using low-cost adhesives in thinning and backside processing towards increasing throughput and reducing cost. Examples will include semiconductor wafer and die thinning and at least one non-semiconductor thin substrate practice.
John Moore, President
Daetec, LLC
Camarillo, CA
USA


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