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Newly Developed Ultra Low CTE Materials for Thin Core PKG
Keywords: Ultra Low CTE Material, Low Warpage, PoP
Warpage reduction is one of the biggest challenges for thinner substrate applications(CSP, PoP). And the ultra low CTE core material is required as the key solution for it. Followed by that requirement, we developed ultra Low CTE thin core material with our own resin technology and the filler treatment technology. This material has high thermal reliability i.e., high thermal decomposition temp, lead-free process compatibility as well as ultra low CTE(X) property which is defined as below 3ppm/degC. We evaluated actual warpage behavior of this material as die mounted substrate constructions before/after assembly process to see the advantage of this material properties.
Takahiro Tanabe, Engineering Manager
Hitachi Chemical Co. America, Ltd.
Cupertino, CA

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