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Materials Advances Enable Thinner Packages
Keywords: eWLP, DBG, LCM
Consumer desire for electronics products packed with higher functionality in ever decreasing dimensions has driven developments in the semiconductor packaging market for some time. It seems that with every decrease in dimension, the industry wonders how much smaller these designs can go while simultaneously delivering more capability. Not only are the requirements for smaller outlines, but for far thinner devices as well. And, in order to achieve this, the die used in modern packages must continue to decrease in thickness, which presents significant challenges from a materials and handling point of view. This paper will address advances in materials technology that are enabling robust, high functioning ultra-thin packages. Developments that will be discussed include: conductive die attach film for thinning leadframe-based packages such as QFPs and QFNs; liquid compression molding for embedded wafer level packages (eWLPs) to allow for thinner molding of reconstituted wafers; die attach film and wafer backside coating (WBC) materials with dice before grind (DBG) technology to enable thinner bondlines and stacking of thinner dies; and, non-conductive paste (NCP) and wafer applied underfill developments that facilitate the use of much thinner die for bottom side package-on-package (POP) devices.
YounSang Kim, Director, Technology
Henkel Electronic Materials LLC
Irvine, CA
USA


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