Micross

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Thinning of WLP for 3D Packaging
Keywords: WLP, Thinning, TSV
One of the early calls to 3D packaging was wafer on wafer (WOW)packaging. A detractor from the WOW method has been die yield. Stacking wafers multiplies the yield loss in the stacked packages. One possible solution being evaluated is assembling a wafer or panel of Known Good Die (KGD) and then stacking the created wafers or panels. As with traditional TSV wafers the created wafers are thinned to expose the interconnects. This paper will discuss the state of the art for thinning and exposing the interconnects for traditional TSV wafers as well as the unique challenges with created wafers.
Scott Sullivan, Chief Technologist
DISCO Corp.
Santa Clara, CA
USA


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