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Fine Pitch Copper Pillar Assembly Platform - Enabling Thinner Packages in a Mobile World
Keywords: copper pillar, thin package, fine pitch
The emergence of smart phones and other advanced mobile devices has created a continuous drive to develop thinner electronic packages with increased functional IC integration – to meet the end users' demand for more multimedia content, connectivity, and mobility. From an IC packaging standpoint, selecting the appropriate assembly platform is crucial to meet the quality, reliability, cost, and scalability requirements for thinner packages containing advanced IC devices. Special consideration must be given to the IC interconnection, package material selection, and assembly process to ensure that a thinner package construction is as robust as its contemporary package alternatives. To help meet the increased functional integration and performance requirements, the IC designers utilize advanced silicon nodes with low-k dielectrics while often times keeping the die size relatively unchanged. This results in a very dense interconnect on a fragile dielectric structure, which presents significant challenges to the package assembly house. This paper discusses how the fine pitch copper pillar (FP Cu Pillar) assembly platform addresses several of the packaging challenges presented by advanced IC devices and how it enables thinner package solutions. Process, material, and package attributes will be presented, including compatibility with conventional bumping technologies, low-k dielectric structures, aggressive die bond pad pitches, and thin die constructions. In addition, various fine pitch Cu Pillar design benefits will be explored to illustrate how thinner and smaller packages are achievable. And finally, several FP Cu Pillar package constructions will be presented that show the enabling characteristics of this exciting new platform technology for thin package solutions.
Curtis Zwenger, Sr. Director, Package Development
Amkor Technology
Chandler, AZ
USA


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