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eWLB Technology Enables Thin 3D Packaging
Keywords: eWLB, WLCSP, Packages
WLCSP has typically provided the thinnest available package profile with the final package no larger than the die size itself and thinning of the silicon possible in mass production. A limitation of the standard fan-in package format has been the number of bumps available to fit onto the die at 0.4mm or 0.5mm pitch. STATS ChipPAC's eWLB technology has extended the WLP package space by creating a fan-out area beyond the original die size. This innovation has also allowed multi-die packages to be created in a similar WLP form factor, creating options for very thin multi-die packages. Beyond this 2D capability it is possible to create novel 3D structures enabling stacked die structures with a very thin profile. This presentation will discuss the state of the art in thin stacked packages using eWLB technology as well as the package roadmap for these innovative packages.
Tom Strothmann,
Tempe, AZ

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