Here is the abstract you requested from the TT_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|NAMICS Materials for Thin & Advanced Packaging Technology|
|Keywords: Mobile Devices, Reliability, TSV|
|The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. Thru Silicon Via (TSV), sub-100μm die thickness, and 3-D are a few of the latest techniques engineers use to solve these issues. As technology progress to smaller process generations new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in thermal compression bonding (TCB), vacuum underfill (VUF), wafer level and pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Thin & Advanced Packaging Technology; Capillary Underfill (CUF), Vacuum Underfill (VUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF), High Thermal Conductivity, Conductive & Non-Conductive Die Attach Materials.|
|Brian Schmaltz, Western Area Sales Manager
NAMICS Technologies Inc.
San Jose, CA