Here is the abstract you requested from the TT_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Next Generation ABF Materials|
|Keywords: Packaging Substrates , Epoxy Resins, Thin Copper|
|Ajinomoto build-up films (ABF) are widely used as insulating layers for packaging substrates due to their features of good reliability, excellent processability and well-balanced properties. The present ABF for the mass-production are halogen-free GX series that show high glass transition temperature (Tg) and good insulation reliability, and specifically they are designed to be etched by alkaline permanganate solution (desmear process) to form micro anchors on the resin surface for its high adhesion with plated copper. Recent developments can meet the demands of lower anchor and lower CTE (Coefficient of Thermal Expansion). For high speed applications of MPU or ASIC, ABF-GZ that is composed of cyanate ester and epoxy network system has been developed to achieve lower dielectric loss tangent. In addition, to match the thin-core or core-less structures, we' can supply prepreg materials consisting of the same resin composition as ABF and glass cloth. In terms of the warpage of packaging substrates, the lower CTE dielectric materials seem to have advantages for its reduction. Finally, we'd like to propose the new process using our thin copper transfer film that can provide the high adhesion between low-CTE ABF and copper without anchor effects. In this presentation, I'd like to introduce our dielectric materials especially recent developments as well as their processability of build-up technologies.|
Kawasaki, Kanagawa 210-8681,