Here is the abstract you requested from the Wirebond_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Effect of Force and Power Ramping of the Bonding of Large Packages for Heavy Aluminum Wire Bonds|
|Keywords: Wirebonding, Force Ramping, Heavy Aluminum Wire|
|Wire bonding under-the-hood automotive-electronic packages that use molded leadframes and pin-terminal-connectors become difficult when unseen contaminants and poor rigidity are present. This paper will discuss how force and power ramping can help to reduce the effects of unseen contamination and rigidity problems.|
|Mario Marin, Engineering Mananer for New Programs
Delphi Automotive Systems
El Paso, TX