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The Effect of Force and Power Ramping of the Bonding of Large Packages for Heavy Aluminum Wire Bonds
Keywords: Wirebonding, Force Ramping, Heavy Aluminum Wire
Wire bonding under-the-hood automotive-electronic packages that use molded leadframes and pin-terminal-connectors become difficult when unseen contaminants and poor rigidity are present. This paper will discuss how force and power ramping can help to reduce the effects of unseen contamination and rigidity problems.
Mario Marin, Engineering Mananer for New Programs
Delphi Automotive Systems
El Paso, TX
USA


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