Micross

Abstract Preview

Here is the abstract you requested from the Wirebond_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

The Use of Ultrasonic Bond Waveforms as an Alternative Low-Cost Method for Process Control for High Volume Automotive Electronic Modules
Keywords: Heavy Aluminum Wirebond, Bond Wave Forms, Process Control
With automotive-electronic modules, the on-going process control of heavy aluminum wire bonding on high-volume production became expensive when destructive testing is utilized. The large number of modules used during production to for control charting purposes is quite expensive. This paper will discuss how a statistical process control can be enhanced by frequent observations of ultrasonic bond traces without a degradation of quality.
Mario Marin, Engineering Manager for New Programs
Delphi Automotive Systems
El Paso, TX
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems