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The Use of Ultrasonic Bond Waveforms as an Alternative Low-Cost Method for Process Control for High Volume Automotive Electronic Modules
Keywords: Heavy Aluminum Wirebond, Bond Wave Forms, Process Control
With automotive-electronic modules, the on-going process control of heavy aluminum wire bonding on high-volume production became expensive when destructive testing is utilized. The large number of modules used during production to for control charting purposes is quite expensive. This paper will discuss how a statistical process control can be enhanced by frequent observations of ultrasonic bond traces without a degradation of quality.
Mario Marin, Engineering Manager for New Programs
Delphi Automotive Systems
El Paso, TX

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