Abstract Preview

Here is the abstract you requested from the Wirebond_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

A New Look at Fine Wire Aluminum Bonding for Molded Packages
Keywords: Fine wire aluminum bonding, Alternate to copper wirebonding, Reliability
This talk will present a new look at fine wire aluminum wedge bonding for molded plastic packages as an alternative to copper wirebonding. Aside from being at least 3x less expensive than copper, aluminum wirebonding offers a number of other advantages such as room temperature bonding, elimination of any gas shielding (required with copper wirebonding), bonding on bare copper leadframes eliminating the need for silver plating, bonding on active circuitry without the need for over pad metallization protection, and high temperature applicability due to the mono-metallic nature of the interconnect with the bond pads. Modifications to a wedge bonder boosted throughput to a level comparable to current copper wirebonding UPH of 12 wires/sec. The presentation will provide highlights of the development process covering the advantages listed earlier, including comprehensive reliability data on packages with green mold compounds.
K. Pham, Staff Equipment Engineer
National Semiconductor Corporation
Santa Clara, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic