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Multipurpose Wire Bonding - Wires, Bumps, and Combination Interconnects
Keywords: Wire Bond, Ball Bump, Stud Bump
Today's multipurpose wire bonding machines are required to deliver a combination of wires, bumps, and specialty interconnects. Multipurpose wire bonders accommodate large work area, deep access, and a complex mix of bond surfaces, wire shapes, and bumps. This paper will provide a survey of application cases highlighting different bumps and wires to show the range of capabilities available to packaging engineers.
Daniel D. Evans, Jr., Senior Scientist / Application Manager
Palomar Technologies
Carlsbad, CA
USA


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