Here is the abstract you requested from the Wirebond_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Evaluation of Al-Cu Intermetallic Growth at High Temperatures used in PowerClad Ribbon & Leadframe Bonding Applications|
|Keywords: Ribbon, Lead Frame, High Temperature|
|Many of the electronic packages are rated up to 150 degrees C. However, there are many new applications that require the modules to survive at much higher temperatures. This paper will discuss the intermetallic growth between the Al-Cu interface of PowerClad ribbon as well as Al-Inlay-Cu leadframes at these elevated temperatures.|
|Mike McKeown, Power Electronics Manager
Materion Technical Materials