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Evaluation of Al-Cu Intermetallic Growth at High Temperatures used in PowerClad Ribbon & Leadframe Bonding Applications
Keywords: Ribbon, Lead Frame, High Temperature
Many of the electronic packages are rated up to 150 degrees C. However, there are many new applications that require the modules to survive at much higher temperatures. This paper will discuss the intermetallic growth between the Al-Cu interface of PowerClad ribbon as well as Al-Inlay-Cu leadframes at these elevated temperatures.
Mike McKeown, Power Electronics Manager
Materion Technical Materials
Lincoln, RI

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