Here is the abstract you requested from the Wirebond_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Fine Pitch Cu Wire Bonding Reaching Maturity|
|Keywords: fine Cu wire bonding, extended reliability, high volume manufacturing|
|After more than 40 years of Au wire bonding and more than 20 years of heavy Cu wire bonding, the Au commodity prices have finally pushed fine Cu wire bonding in to volume manufacturing. The initial scepticism has been overcome in most cases by a rigorous qualification methodology and more importantly an even more rigorous manufacturing control from process, to operators, to clean room. The geneneral scientific models of Cu wire bonding: slower IMC formation and growth have been confirmed while accommodating higher hardness and resulting Al splash. Extended JEDEC type reliability testing has reached as much as 6x standard test condition life suggesting that Cu bonds can be as reliable or more than Au. Most applications have been qualified and are in high volume production. The next application space that is near completion of qualification is automotive.|
|Bernd K. Appelt, Dir Business Development