Micross

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Here is the abstract you requested from the Wirebond_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Enabling Ultra Fine Pitch Copper Wire Bonding: FAB Formation
Keywords: Copper , Fine pitch, FAB Formation
Abstract to come
John Foley, Sr. Staff Engineer
Kulicke and Soffa Industries
Ft. Washington, PA
USA


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