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Advanced Bonding Technology for High Temperature Operational Electrified Vehicles
Keywords: Bonding Technology, High Temperature, Electrified Vehicles
This paper presents an advanced bonding technology providing high reliability for high temperature operational power electronics in electrified vehicles. The transition toward electrified vehicles is fostering particular interest in the development of advanced assembly methods sustainable at high temperature operation, which enforces serious lifetime problems in conventional bonding methods used for die attachment. Thus, advanced bonding technology is strongly demanded. Nickel-tin transient liquid phase (Ni-Sn TLP) bonding presented herein addresses such challenges and is anticipated to be a promising solution. The Ni-Sn TLP bonding process exhibits a number of desirable characteristics: High remelting temperature, relatively low processing temperature and pressure, a good CTE match with silicon and silicon carbide, popularity in conventional power electronics, low cost, and uniform alloy formation. This work presents a Ni-Sn TLP bonding technology (ready for high temperature operation up to 200 degC) as applied to large size silicon power devices (12 mm x 9 mm). The performance and reliability of Ni-Sn TLP bonding were characterized using various analysis methods. Analysis indicates that the resulting bondline is uniformly composed of a single Ni-Sn alloy throughout a large device area without left-over Sn. The alloy is confirmed to be Ni3Sn4 and enables a homogenous bondline. In addition, this bonding approach has exhibited excellent reliability for bonded devices after thermal cycles from -40 to 200 degC.
Sang Won Yoon, Senior Scientist
Toyota Research Institute of North America
Ann Arbor, MI
USA


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