Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Reliability Concerns - Pitfalls and Issues (and How to Avoid them)|
|Keywords: Reliability, Materials, New Processes|
|This material or process has not been used in this application - how do you know that it will work? This paper will address the methods, materials, and processes that can be incorporated or used to address the reliability concerns in new product development. The impact of material and process choices on product reliability will be discussed in the following cases: The use of conformal coatings, Underfill adhesives, and Potting for Electronics Packaging - where to get the most bang for your buck. The use of RoHS certified parts - where is this smart and what preventative measures can be taken to help reliability. The use of Adhesives, pads, and mechanical process elements used for improved thermal paths. Board layout dos and dont's - what helps grounding, assembly processes, and thermal. The overlaying automotive environment is key to the demonstration of the principles and methods above. Analysis and test results for electronics that are used underhood will provide the basis for the comparisons shown.|
|Tina Barcley, Owner and CTO