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Advances in Pressure-less Sintering for High Temperature Electronic Applications
Keywords: Ag Sintering, Reliability, High Performance
During the past decade green initiatives have spearheaded implementation of lead-free solutions and recycling efforts in electronics packaging and interconnect industry. Although several lead-free alloys have successfully implemented for second level interconnects, there still is a need for a robust solution at first level. The current paper presents a lead-free first level interconnect material based on principle of low-temperature pressure-less silver sintering technology. This novel formulation enables achieving low bond-line porosity comparable to pressure-assisted sintering process. Also, compared to most pressure-less nano-silver technologies, the use of micro-scaled silver particles in this formulation offers a competitive balance among cost, performance, and processing capability. The proposed silver sintering paste can be sintered at a temperature as low as 200C in a standard box oven without need for any specialized capital intensive equipment. Thermal and electrical properties as well as reliability tests that detail process-property-microstructure relationships will be explored in this paper.
Paul Gleeson, Global Paste TS Technology Champion
Henkel Electronics
Irvine, CA

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